Selected Publications

David D. Allred, R. Steven Turley, and Matthew B. Squires
We have developed a new family of EUV multilayer mirror coatings using uranium. Using this approach we have coated a set of six mirrors for the EUV Imager, a component of the IMAGE mission. This mission is a Medium Explorer (MIDEX) program, which is scheduled for launch early in 2000. The EUV Imager will study the distribution of He+ in the Earth's plasmasphere by detecting its resonantly scattered emission at 30.4 nm (41 eV) and will produce images of the structure and dynamics of the cold plasma on a global scale. There is, however, a bright emission at 58.4 nm (21 eV), which comes from neutral helium in the earth's ionosphere which also must be blocked. These photons are at too high an energy to filter with aluminum but at too low an energy to have negligible reflectance from most materials commonly used in EUV mirrors. Thus, a multilayer system which satisfied two optical functions, high reflectance (greater than 20%) at 41 eV and low reflectance (less than 2%) at 21 eV, were designed and successfully fabricated. Such mirrors with dual optical functions in the soft x-ray/EUV had not previously been designed or built. These specifications were particularly challenging because many materials have higher single layer reflectances at 58.4 nm than at 30.4 nm. Essentially, the mirror must have low reflectance at 21 eV without loss of reflection at 30.4 nm. This was accomplished. The top part of the multilayer, which reflects well at 30.4 nm, also acts as antireflection layers at 58.4 nm. In the past, multilayers usually have consisted of periodic bilayers. We have explored the use of a periodic mirrors in place of the standard periodic designs. Along the way we have created the computational tools, which include genetic algorithms, to optimize selection of materials and thicknesses. We are currently in the process of building up an EUV characterization system and developing a general way of measuring the optical constants of air-sensitive thin films. We discuss the other material and fabrication challenges faced, which include: (1) The high absorption of almost everything in the EUV. This means that only a few interfaces in a multilayer will contribute to its reflectance. (2) Surface contamination and corrosion. (3) The deposition on flight mirrors that are highly curved (f equals 0.8).
Matthew B. Squires, David D. Allred, and R. Steven Turley
This paper is a report on our effort to use reflectance measurements of a set of amorphous silicon (a-Si) and uranium (U) multilayer mirrors with an uranium oxide overcoat to obtain the optical constants of a-Si and uranium. The optical constants of U, its oxides, and Si, whether crystalline or amorphous, at 30.4 and 58.4 nm in the extreme ultraviolet (EUV) are a source of uncertainty in the design of multilayer optics. Measured reflectances of multilayer mirror coatings do not agree with calculated reflectances using existing optical constants at all wavelengths. We have calculated the magnitude and the direction of the shift in the optical constants of U and a-Si from reflectivity measurements of DC magnetron sputtered a-Si/U multilayers at 30.4 and 58.4 nm. The reflectivity of the multilayers were measured using a UV hollow cathode plasma light source, a 1 meter VUV monochromator, a back-thinned CCD camera, and a channeltron detector. These reflectance measurements were verified by measurements made at LBNL. The reflectances of the multilayer coatings were measured at 14.5 degrees from normal to the mirror surface. The optical constants were calculated using IMD which uses CURVEFIT to fit the optical constants to reflectivity measurements of a range of multilayer mirrors that varied over a span of 150 - 25.0 nm bilayer thickness. The effects of surface oxide and roughness, interdiffusion, and interfacial roughness were numerically subtracted in fitting the optical constants. The (delta) , (beta) determined at 30.4 nm does not well match the values of c-Si published in the literature (HBOC1), but do approach those of a-Si as reported in literature (HBOC). The difference in the optical constants of c-Si and a-Si are larger than can be attributed to differences in density. Why the optical constants of these two materials vary at 30.4 remains an open question.
D. D. Allred (et al.)
The design and performance of an electrochemical apparatus and, the process for the preparation of porous silicon with different controlled surface structures is described. The apparatus includes controlled rotation of the electrolyte vessel, which is in contact with a thermal bath. This permits the etching electrolyte to react with the silicon substrate at different temperatures and at different rates of renewal of the solution. Atomic force microscopy images show at least three different classes of samples according to the topographical features: samples with surface hillocks, samples with surface holes, and samples with a mixture of holes and hillocks. The different morphologies are important for various applications. (C) 1999 Published by Elsevier Science Ltd. All rights reserved.
G. B. Thompson and D. D. Allred

We report the preparation and structural characterization of lithium hydride and lithium fluoride thin films. These materials, due to their low absorption in the soft x-ray range, may have a role as spacer layers in multilayer mirrors. Theoretical reflection calculations suggest that an epitaxial crystalline multilayer stack of a nitride and a lithium compound spacer layer could produce respectable reflectance for short soft x-ray wavelengths (λ < 10 nm). Lithium targets were magnetron sputtered in the presence of hydrogen or ammonia to prepare the LiH films and nitrogen trifluoride to prepare the LiF films. The films were deposited on room temperature Si (100) or MgO (100) substrates. A near IR-Visible-UV spectrometer indicated a drop in reflectance at ~250 nm for a 100-nm-thick LiH film. This corresponds to a 5-eV band gap (characteristic of LiH). UV fluorescence indicated characteristic LiH defect bands at 2.5, 3.5, and 4.4 eV. The UV fluorescence characterization also indicated a possible lithium oxide (Li2O) contamination peak at 3.1 eV in some of our thin films. Film surface morphology, examined by scanning electron microscopy, appeared extremely rough. The roughness size varied with reactive gas pressure and the type of substrate surface. A LiH/MoN multilayer was constructed, but no significant d spacing peak was seen in a low angle CuKα XRD scan. It is believed that the roughness of the LiH film prevented smooth, uniform planar growth of the multilayer stack. Possible reasons of rough growth are briefly discussed.

Using perturbed-angular-correlation (PAC) spectroscopy, via the Hf-181-->Ta-181 probe, we have measured Mn-site electric-field gradients (EFG's) at Ta nuclei in ceramic samples of LaMnO3. Two crystallographic phases coexist over a temperature interval of approximate to 16 K near the orthorhombic-to-rhombohedral transition at approximate to 724 K, which shows a thermal hysteresis of approximate to 1.7+/-0.2 K. Concurrently, in the two phases, we determined the temperature dependence of the EFG parameters, V-zz, eta, and delta, and the ratio of the probe concentrations A(1)/A(2) To explain the apparent coexistence of two phases in this weakly first-order transition, we present a model that assumes a spatial distribution of T-c values. This distribution could arise from a spatially nonuniform distribution of Mn4+ ions. We show the PAC technique to be a uniquely powerful probe of local symmetries that reflect the effects of a local-distribution of valences, which drive the phase transition.
D. D. Allred (et al.)

We report the effect that thermal annealing in inert and oxidizing atmospheres, and with and without encapsulating layers, has on the structure of tungsten/carbon [W/C] multilayer thin films. This study focuses on the tungsten component and deals mainly with multilayers where the ratio of thickness of tungsten layers is equal to or greater than for the carbon layers (that is, γ ≤ 0.5). This is in contrast to prior studies where the tungsten layer thickness was generally held constant and the carbon layer was varied. Thermal annealing in inert atmospheres produces reactions and other structural changes in the tungsten and carbide layers which depend on the as-deposited multilayer structure which depends, in turn, on the thickness of the tungsten layer. In samples where both the tungsten and carbide fractions of the multilayer are completely amorphous as deposited, which is the case for thin tungsten layers (thickness of tungsten (tw) < 4 nm/period), the reactions in the tungsten layer forming crystalline tungsten and tungsten carbide occur at annealing temperatures above 900°C. The layer pair spacing, or period, (d), in this group shows an expansion of up to 10–15% of the original value as has been reported in the past. Changes in both the tungsten and carbide layers, and their interfaces, contribute to changes in d spacing and relative thickness of the high and low Z components. When the tungsten layer thickness exceeds 4 nm per period the tungsten is partially crystallized in as-prepared samples. In such multilayers interfacial reactions, producing an oriented partially crystalline W2C/C superlattice, occur at temperatures of 600°C and below. The fact that W2C crystallites in one period can form a structure which is correlated to W2C crystallites in neighboring layers is somewhat surprising, since layers are presumably still separated by amorphous carbon which is still visible via Raman. The expansion of the layer pair spacing is relatively small (<5%) in this group and, more importantly, mostly involves increases in the thickness of the high Z components. Samples annealed in air at temperatures below 300°C are progressively destroyed by the oxidation of both tungsten and carbide layers. Encapsulation of similar multilayers with a thin (30 nm) dielectric layer of any of several types can retard oxidation to 600°C. The silicon-containing encapsulants generally perform better. Failure at this temperature is seen to occur from pinhole formation.